Business Details
50+ Years
experience
Your Trusted Semiconductor Packaging and Test Partner
Amkor Technology has evolved from its origins in 1968 to become a global leader in semiconductor packaging and test services. With over 50 years of innovation, we operate 20 manufacturing facilities across 11 countries, employing more than 30,000 professionals dedicated to advancing semiconductor technology. Our expertise spans design, wafer bumping, package characterization, and advanced test solutions, supporting industries ranging from automotive to artificial intelligence.We maintain strategic partnerships with leading technology firms and invest heavily in sustainable practices, including verified emissions reduction targets. Our commitment to excellence is demonstrated through certifications like IATF 16949 and cutting-edge technologies such as S-Connect and S-SWIFT. Headquartered in Tempe, Arizona, we combine American innovation with Korean heritage to deliver reliable, high-quality solutions for global clients.
Services
Semiconductor Packaging
Test Services
Wafer Bumping
Design Services
Package Characterization
Details
- Year established: 1968
Highlights and features
- We offer 50+ years of semiconductor packaging expertise
- Our global network spans 20 facilities across 11 countries
- We develop cutting-edge technologies like S-Connect and S-SWIFT
- Our team holds verified science-based emissions reduction targets
- We maintain strategic partnerships with leading semiconductor manufacturers
Associations and certifications
- IATF 16949
Services
Semiconductor Packaging
We provide advanced semiconductor packaging solutions including laminate, leadframe, and wafer-level technologies. Our services support miniaturization while maintaining thermal and electrical performance for applications in automotive, communications, and computing sectors. Our global facilities ensure scalable production capabilities for diverse client needs.
Test Services
Our comprehensive test services cover wafer probe, final test, and system-level validation. We employ state-of-the-art equipment to ensure reliability and performance across various semiconductor applications. Our solutions help clients reduce time-to-market while maintaining strict quality standards for complex electronic systems.
Wafer Bumping
We offer electroplated bumping and wafer-level chip scale packaging (WLCSP) services. Our capabilities include lead-free and copper pillar solder compositions across 200mm and 300mm wafers. Co-located with assembly and test facilities, our bumping services enable integrated manufacturing workflows for flip chip and WLCSP applications.
Design Services
Our design centres provide package co-design and verification solutions using advanced tools. We offer chip-package-board co-optimization, design-for-cost analysis, and package assembly design kits (PADKs). With global engineering teams, we support clients from concept through production for optimal performance and manufacturability.
Package Characterization
We conduct comprehensive mechanical, thermal, and electrical characterization of semiconductor packages. Our services include JEDEC standard compliance testing, custom thermal solutions, and high-speed signal integrity analysis. These capabilities ensure packages meet rigorous reliability requirements across diverse operating environments.
Questions
What semiconductor packaging solutions do you offer?
We provide laminate, leadframe, and wafer-level packaging technologies including advanced formats like FCBGA, fcCSP, and WLCSP for diverse industry applications.
How long has Amkor been in business?
We have 55+ years of semiconductor industry experience, established in 1968 with continuous innovation in packaging and test technologies.
Where are your manufacturing facilities located?
We operate 20 facilities across 11 countries including the US, China, Japan, Korea, Taiwan, Portugal, Malaysia, Philippines, Singapore, Vietnam, and Germany.
What advanced packaging technologies do you develop?
We pioneer technologies like S-Connect (bridge die interposer) and S-SWIFT (chiplet integration) to enable next-generation semiconductor performance and miniaturization.
Do you offer sustainability-focused manufacturing practices?
Yes, we maintain verified science-based emissions targets and implement energy-efficient processes across our global manufacturing network.
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